By Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

This e-book explains for readers how 3D chip stacks promise to extend the extent of on-chip integration, and to layout new heterogeneous semiconductor units that mix chips of other integration applied sciences (incl. sensors) in one package deal of the smallest attainable size.  The authors specialize in heterogeneous 3D integration, addressing essentially the most very important demanding situations during this rising expertise, together with contactless, optics-based, and carbon-nanotube-based 3D integration, in addition to signal-integrity and thermal administration concerns in copper-based 3D integration. assurance additionally comprises the 3D heterogeneous integration of strength assets, photonic units, and non-volatile stories in line with new fabrics systems.

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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

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